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Credit Card L/C D/A D/P T/T Western UnionIn Stock 4N High Purity Copper Cu Sputtering Target
Introduction
Copper Backing Plate is used for improving the conductivity of the nonmetallic plasma sputtering targets.
Chemical Symbol | Copper |
Thickness | 2.3 mm OR customized size |
Weight | 1 oz or 2 oz |
Color | Reddish Brown |
Application Notes |
Used for bonding with nonmetallic sputtering targets.
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Wechat:18832681205 Whatsapp :+86 18832681205 Email: Daisy@foam-material.com
Wechat:18832681205 Whatsapp :+86 18832681205 Email: Daisy@foam-material.com
Wechat:18832681205 Whatsapp :+86 18832681205 Email: Daisy@foam-material.com
Wechat:18832681205 Whatsapp :+86 18832681205 Email: Daisy@foam-material.com
Wechat:18832681205 Whatsapp :+86 18832681205 Email: Daisy@foam-material.com
Wechat:18832681205 Whatsapp :+86 18832681205 Email: Daisy@foam-material.com
Wechat:18832681205 Whatsapp :+86 18832681205 Email: Daisy@foam-material.com